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Media Coverage
| 02–13–26
EDN announces winners of the 2025 Product of the Year Awards](https://www.edn.com/edn-announces-winners-of-the-2025-product-of-the-year-awards/)
Press Release
| 02–10–26
Empower Introduces High-Density Embedded Silicon Capacitors to Advance Next-Generation AI and HPC Performance
Empower Semiconductor will present the latest power delivery network–optimization strategies at Chiplet Summit and DesignCon 2026 MILPITAS, Calif. – February](/content/empower-introduces-high-density-embedded-silicon-capacitors-to-advance-next-generation-ai-and-hpc-performance/index.html)
Media Coverage
| 02–03–26
Why power delivery is becoming the limiting factor for AI](https://www.edn.com/why-power-delivery-is-becoming-the-limiting-factor-for-ai/)
Media Coverage
| 05–19–26
Analog Devices to Acquire Empower Semiconductor, Expanding its Next-Generation High-Density Power Portfolio for the AI Era](https://www.analog.com/en/newsroom/press-releases/2026/5-19-2026-adi-to-acquire-empower-semiconductor.html)
Media Coverage
| 03–26–26
A Look into Commercially Available IVRs](https://www.powerelectronicsnews.com/a-look-into-commercially-available-ivrs/)
Press Release
| 03–10–26
Empower Semiconductor Showcases Vertical Power Delivery Innovations at APEC 2026
Two APEC industry sessions and next-generation current density advances underscore Empower’s leadership in powering kilowatt-class AI processors MILPITAS, Calif. –](/content/empower-semiconductor-showcases-vertical-power-delivery-innovations-at-apec-2026/index.html)
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Media Coverage
| 05–19–26
Analog Devices to Acquire Empower Semiconductor, Expanding its Next-Generation High-Density Power Portfolio for the AI Era](https://www.analog.com/en/newsroom/press-releases/2026/5-19-2026-adi-to-acquire-empower-semiconductor.html)
Media Coverage
| 03–26–26
A Look into Commercially Available IVRs](https://www.powerelectronicsnews.com/a-look-into-commercially-available-ivrs/)
Press Release
| 03–10–26
Empower Semiconductor Showcases Vertical Power Delivery Innovations at APEC 2026
Two APEC industry sessions and next-generation current density advances underscore Empower’s leadership in powering kilowatt-class AI processors MILPITAS, Calif. –](/content/empower-semiconductor-showcases-vertical-power-delivery-innovations-at-apec-2026/index.html)
Meet us at these Upcoming Events
2026 OCP APAC Summit
Tue, Aug 11 – 2026 – Wed, Aug 12 – 2026
TaiNEX2, Taipei City, Taiwan
Booth S01 | Vertical power delivery and power integrity solutions engineered for the world’s most power-hungry AI processors. Discover how
2026 OCP Global Summit
Mon, Oct 12 – 2026 – Thu, Oct 15 – 2026
San Jose Convention Center, San Jose, California
Vertical power delivery and power integrity solutions engineered for the world’s most power-hungry AI processors. Discover how our technology unlocks
APEC 2027
Mon, Mar 08 – 2027 – Wed, Mar 10 – 2027
Ernest N. Morial Convention Center, New Orleans, Louisiana
Booth 1550 | Vertical power delivery and power integrity solutions engineered for the world’s most power-hungry AI processors. Discover how